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Demons
Lv5
3
900 积分
2023-11-16 加入
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Improved microstructure, mechanical properties and electrical conductivity of the Cu–Ni–Sn–Ti–Cr alloy due to Ce micro-addition
16天前
已完结
Multilayer graphene interface enabled ultrahigh extensibility for high performance bulk nanostructured copper
1个月前
已完结
Preparation and properties of graphene reinforced Cu/0.5CeO230Cr electrical contact materials
1个月前
已完结
Mechanical and electrical properties of Cu30Cr0.2Zr composites enhanced by CeO2/GO
1个月前
已完结
Thermal deformation behavior of GO/CeO2 in-situ reinforced Cu30Cr10W electrical contact material
1个月前
已完结
Fabrication of graphene/copper nanocomposites via in-situ delamination of graphite in copper by accumulative roll-compositing
3个月前
已完结
Fabrication of graphene/Cu composites with in-situ grown graphene from solid carbon source
3个月前
已完结
Interface diffusion and mechanical properties of ODS-W/Cu prepared by spark plasma sintering
3个月前
已完结
Microstructure and characteristics of Cu-W composite prepared by W-coated Cu powder with different W contents
3个月前
已完结
Effect of Sn/Cu thickness ratio on the transformation law of Cu6Sn5 to Cu3Sn in Sn/Cu interface during aging
3个月前
已完结
没有进行任何应助
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4个月前
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