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1060 积分 2023-12-05 加入
Predicted Stresses in Wire Bonds of Plastic Packages During Transfer Molding
2小时前
待确认
Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules
4个月前
已完结
Advanced SOI gate driver IC with integrated VCE-monitoring and negative turn-off gate voltage for medium power IGBT modules
6个月前
已完结
Status and Trend of High Power IGBT Gate Drive Technology
11个月前
已关闭
Hybrid Si/SiC Switches: A Review of Control Objectives, Gate Driving Approaches and Packaging Solutions
11个月前
已完结
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