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40 积分 2026-03-30 加入
Effect of surface pretreatment on the surface performance of epoxy resin
22天前
已完结
Composite graphene conductive solution for PCB hole metallization applications
22天前
已完结
1-Dodecyl-2-methyl-3-benzylimidazolium chloride as a novel leveler: Towards simultaneously both the microvia void-free filling and through hole conformal thickening
22天前
已完结
Multiphysics simulation and experimental study on uniformity of jet electrodeposited bronze coating in deep small hole
22天前
已关闭
Polypyrrole conductive film formed by in-situ polymerization as a conductive seed layer for hole metallization of printed circuit boards and blind hole electroplating filling behavior
1个月前
已完结
Effect of Electroplating-Induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes
1个月前
已完结
Interfacial Leveler-Accelerator Interactions in Cu Electrodeposition
1个月前
已完结
Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs
1个月前
已完结
1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating
1个月前
已完结
Unveiling the potential and mechanisms of 3,3′-bicarbazole-based quaternary ammonium salts as levelers
1个月前
已完结
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