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40 积分 2026-03-30 加入
Effect of Electroplating-Induced Copper Thickness Variations on the Thermomechanical Reliability of Plated Through Holes
5天前
已完结
Interfacial Leveler-Accelerator Interactions in Cu Electrodeposition
10天前
已完结
Analysis of throwing power for megasonic assisted electrodeposition of copper inside THVs
10天前
已完结
1-(2-Pyridylazo)-2-naphthol as a synergistic additive for improving throwing power of through hole copper electronic electroplating
10天前
已完结
Unveiling the potential and mechanisms of 3,3′-bicarbazole-based quaternary ammonium salts as levelers
11天前
已完结
Experimental and theoretical study of high-flat and stable leveler tetrazolium blue chloride in the thickening process of copper through holes
28天前
已完结
A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening
28天前
已完结
A novel inorganic leveler of sodium azide for high aspect ratio through-holes uniform Cu thickening with high throwing power by electronic plating
28天前
已完结
Experimental and theoretical study of high-flat and stable leveler tetrazolium blue chloride in the thickening process of copper through holes
1个月前
已完结
A transfer-adsorption model for forward understanding the synergistic effects of additives in through-hole uniform copper thickening
1个月前
已完结
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