Lv1
40 积分 2026-05-19 加入
Development of a deep eutectic solvent based matrix solid-phase dispersion microextraction method for the determination of sudan dyes in food samples
1个月前
已完结
Addressing interconnect challenges for enhanced computing performance
2个月前
已完结
Grain-boundary/interface structures and scatterings of ruthenium and molybdenum metallization for low-resistance interconnects
2个月前
已完结
Exploring ultrathin tungsten disulfide as a diffusion barrier for copper interconnects: advanced packaging reliability and a first-principles study
2个月前
已关闭
Technology review of CNTs TSV in 3D IC and 2.5D packaging: Progress and challenges from an electrical viewpoint
2个月前
已完结
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