Lv5
1398 积分 2022-09-06 加入
Low-Temperature Epoxy-based Cu/Polymer Hybrid Bonding for 3D IC Packaging with Optimized CMP
5小时前
待确认
The Material Dimension of Chinese Hip-Hop: From Tangible Forms to Online Consumption
2天前
待确认
Environmentally responsive dual-compartment microcapsules with full spectrum color-changing performance for anti-counterfeiting applications
11个月前
已完结
Environmentally responsive dual-compartment microcapsules with full spectrum color-changing performance for anti-counterfeiting applications
11个月前
已完结
Environmentally responsive dual-compartment microcapsules with full spectrum color-changing performance for anti-counterfeiting applications
11个月前
已完结
Gold Nanobipyramid‐Supported Silver Nanostructures with Narrow Plasmon Linewidths and Improved Chemical Stability
11个月前
已完结
Bimetallic Nanostructures: Gold Nanobipyramid‐Supported Silver Nanostructures with Narrow Plasmon Linewidths and Improved Chemical Stability (Adv. Funct. Mater. 3/2016)
11个月前
已完结
Sub-nanometre resolution in single-molecule photoluminescence imaging
11个月前
已完结
Surface-enhanced Raman spectroscopy
11个月前
已完结
Gold–Silver Alloy Nanoparticle-Incorporated Pitaya-Type Silica Nanohybrids for Sensitive Competitive Lateral Flow Immunoassay
11个月前
已完结
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