Lv3
300 积分 2024-10-17 加入
Electrical and mechanical package design for 4.5kV ultra high power IEGT with 6kA turn-off capability
9小时前
待确认
Review of the Failure Mechanism and Methodologies of IGBT Bonding Wire
3个月前
已完结
Optimized Design of Chips Layout in Press-Pack IGBT Module
5个月前
已完结
Optimized Design of Chips Layout in Press-Pack IGBT Module
5个月前
已完结
A New Press Pack IGBT for High Reliable Applications With Short Circuit Failure Mode
6个月前
已完结
The Effect of the Surface Roughness Characteristics of the Contact Interface on the Thermal Contact Resistance of the PP-IGBT Module
6个月前
已完结
Junction-to-Case Thermal Resistance Measurement and Analysis of Press-Pack IGBTs Under Double-Side Cooling Condition
8个月前
已完结
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