Lv5
1110 积分 2024-10-17 加入
Detecting Asymmetries Within Multi-Chip SiC Power Modules by Means of the Kelvin Source
17天前
已完结
Design and Assessment of SiC Multi-Chip Power Module with Kelvin Source
17天前
已完结
Charge Balance and UIS Robustness of Trench Field Plate Power MOSFETs
7个月前
已完结
Analysis on BVDSS Outlier Chips and Screening Technology for 1.2 kV Automotive SiC MOSFETs
8个月前
已完结
Investigation of Termination Soft Breakdown Mechanisms in 1700V-SiC MOSFETs Under HTRB with Different Temperatures
8个月前
已完结
Thermo-Mechanical Optimisation of Press-Pack IGBT Packaging Using Finite Element Method Simulation
9个月前
已完结
Study on the Impacts of Clamping Process Defects to the Reliability of Press-Pack IGBTs
1年前
已完结
Investigation on the Short-circuit Withstand Capability of Press-pack IGBT modules with Optimized Package Structures
1年前
已完结
Systematic Analysis and Characterization of Extreme Failure for IGCT in MMC-HVdc System—Part II: Failure Mechanism and Short Circuit Characteristics
1年前
已完结
Determination of the thermal and electrical contact resistance in press-pack IGBTs
1年前
已完结
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