Lv4
710 积分 2024-10-17 加入
Charge Balance and UIS Robustness of Trench Field Plate Power MOSFETs
12天前
已完结
Analysis on BVDSS Outlier Chips and Screening Technology for 1.2 kV Automotive SiC MOSFETs
12天前
已完结
Investigation of Termination Soft Breakdown Mechanisms in 1700V-SiC MOSFETs Under HTRB with Different Temperatures
12天前
已完结
Thermo-Mechanical Optimisation of Press-Pack IGBT Packaging Using Finite Element Method Simulation
2个月前
已完结
Study on the Impacts of Clamping Process Defects to the Reliability of Press-Pack IGBTs
7个月前
已完结
Investigation on the Short-circuit Withstand Capability of Press-pack IGBT modules with Optimized Package Structures
7个月前
已完结
Systematic Analysis and Characterization of Extreme Failure for IGCT in MMC-HVdc System—Part II: Failure Mechanism and Short Circuit Characteristics
7个月前
已完结
Determination of the thermal and electrical contact resistance in press-pack IGBTs
7个月前
已完结
Finite element analysis of thermal contact resistance in Press-Pack IGBT module
7个月前
已完结
Lifetime prediction for press pack IGBT device by considering fretting wear failure
7个月前
已完结
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