Lv11
10 积分 2025-09-10 加入
Direct Bonding of 4H-SiC and SOI Wafers for Radiation-Hardened Image Sensors
3小时前
待确认
High sensitivity x-ray detectors based on 4H-SiC p-i-n structure with 80 μm thick intrinsic layer
1个月前
已完结
Effects of the Thermocompression Bonding on the Microstructure and Contact Resistance for the Ultrafine Pitch Chip-on-Glass Packaging With Nonconductive Film
2个月前
已完结
Development of high-chi directed self-assembly process based on key learning from PS-b-PMMA system
11个月前
已关闭
Layout simulation for directed self-assembly with chemo-epitaxy methodology
11个月前
已关闭
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