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Vertically Aligned Graphene for Thermal Interface Materials
1天前
待确认
Highly Vertically Oriented Graphene Microstrip Pads With Ultrahigh Through‐Plane Thermal Conductivity and Ultralow Compressive Modulus for Efficient Heat Dissipation
2天前
已完结
Sandwich-structured In–Ga alloy phase change thermal pad with low thermal resistance and leakage prevention
2天前
已完结
Improving the Thermal Performance of Liquid Metal Thermal Interface Materials: The Role of Intermetallic Compounds at the Gallium/Copper Interface
2个月前
已完结
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