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148 积分 2025-04-07 加入
Optimization of Wire Bonding Layout for High-Density Power Module Packaging Based on Electro-Thermal Coupling Analysis
1个月前
已完结
Chip formation mechanism in machining of Al/SiCp composites based on analysis of particle damage
7个月前
已完结
Preparation of photo-crosslinkable acrylic copolymer and its debonding property on silicon wafer
9个月前
已完结
An approach for good modeling and forecasting of sea surface salinity in a coastal zone using machine learning LASSO regression models built with sparse satellite time series datasets
10个月前
已完结
Interfacial fracture in soft solids - How geometry and viscoplasticity make crack fronts unstable
1年前
已完结
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