Lv6
1890 积分 2022-10-10 加入
Thermal conductivity and reliability reinforcement for sintered microscale Ag particle with AlN nanoparticles additive
5天前
已完结
Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
5天前
已完结
High thermal conductivity diamond-doped silver paste for power electronics packaging
5天前
已完结
Effect of SiC reinforcement on the reliability of Ag nanoparticle paste for high-temperature applications
11天前
已完结
Comparative Thermal and Structural Characterization of Sintered Nano-Silver and High-Lead Solder Die Attachments During Power Cycling
14天前
已完结
Comparing the mechanical and thermal-electrical properties of sintered copper (Cu) and sintered silver (Ag) joints
14天前
已完结
A review of extreme condition effects on solder joint reliability: Understanding failure mechanisms
15天前
已完结
Thermal fatigue of Ag flake sintering die-attachment for Si/SiC power devices
15天前
已完结
Study on high temperature bonding reliability of sintered nano-silver joint on bare copper plate
21天前
已完结
Carboxylate-Passivated Silver Nanoparticles and Their Application to Sintered Interconnection: A Replacement for High Temperature Lead-Rich Solders
21天前
已完结
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