Lv1
20 积分 2025-06-25 加入
Directional Construction of Thermal Superhighways with Composite Phase Change Materials for Chip Thermal Management Application
5个月前
已完结
Silicon Carbide-Welded Boron Nitride Networks for Self-Healing Flexible Thermal Interface Materials
5个月前
已完结
Universal Mild Exfoliation of Large-Size Two-Dimensional Materials for Thermal Interface Composites
5个月前
已完结
Efficient thermal management of electronic devices by constructing interlayer phonon bridges
5个月前
已关闭
Boron nitride/hydrothermal carbon spheres endowing phase change materials with high thermal conductivity and stability for thermal management
5个月前
已完结
Heat transfer impact of high-performance vapor chamber as integrated heat spreader of computing chips
5个月前
已完结
Interfacial Thermal Transport in Top-Side Diamond Integrated AlGaN/GaN High Electron Mobility Transistors
5个月前
已完结
Engineering Poly(ionic liquid) Composites for Silicone-Free Thermal Interface Materials: Enhanced Thermal Conductivity and Interfacial Adhesion
5个月前
已完结
Electrical Insulation EMI Shielding Epoxy-based Composites with Low Thermal Expansion for Advanced Electronic Packaging
6个月前
已完结
Multiple Crosslinking-Stretch-Induced Multi-Level Orientation Structure BNNS/Ca-SA/D Films with High Thermal Conductive Performance
6个月前
已完结
皖公网安备34019202002308
