Lv12
40 积分 2025-06-25 加入
Electrical Insulation EMI Shielding Epoxy-based Composites with Low Thermal Expansion for Advanced Electronic Packaging
1天前
已完结
Multiple Crosslinking-Stretch-Induced Multi-Level Orientation Structure BNNS/Ca-SA/D Films with High Thermal Conductive Performance
1天前
已完结
High efficiency single and multi-phase direct liquid jet-impingement cooling for heterogeneous packaging
1天前
已完结
An advanced BPNN/RVEA coupled control strategy for novel immersed liquid cooling battery thermal management system
2个月前
已完结
Highly Ductile N-Type Thermoelectric MOF-Based Foams
2个月前
已完结
Carbon-Based 3D Array-Reinforced Thermal Interface Materials with Highly Oriented Structure and Superior Thermal Conductivity
2个月前
已完结
Scalable 3D Thermal Conductivity Architecture of Polyethylene Film via Hot Pressing of Oriented Fibers
2个月前
已完结
Temperature Below 30 mK Achieved by Adiabatic Demagnetization Refrigeration
2个月前
已完结
Ultralight and Elastic Polyimide Microtube Aerogel via Airflow‐Induced Spinning
3个月前
已完结
Anisotropically Thermal‐Protective Porous Ceramics Enabled by Nacre‐Like Framework
3个月前
已完结
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