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230 积分 2025-06-24 加入
Advanced Co-packaged Optics (CPO) Solutions and Technology Challenge for Silicon Photonics Applications
1个月前
已完结
Passively Aligned Glass Micro-Optic Bridge for Expanded-Beam Vertical Coupling and Pluggable Silicon Photonics
1个月前
已完结
Scaling the EMIB-T Advanced Packaging Technology to Address the Future HPC/AI Demand
1个月前
已完结
Glass Core Substrates – Next Generation Advanced Packaging Platform for AI and HPC
1个月前
已完结
Glass Interposer Integration of Logic and Memory Chiplets: PPA and Power/Signal Integrity Benefits
1个月前
已完结
Glass interposer for advanced packaging solution
1个月前
已完结
Collective Die-to-Wafer Bonding of Si Dies and 4-Inch Polycrystalline Diamond Wafer with Ultralow Thermal Boundary Resistance and High Bonding Quality
3个月前
已完结
Optimal Heat Spreading Solutions for Three-Dimensional Heterogeneously Integrated Modules using a Multigrid Topology Optimization Method
4个月前
已完结
IEEE Standard for Ethernet Amendment 4: Physical Layer Specifications and Management Parameters for 100 Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Based on 100 Gb/s Signaling
4个月前
已完结
The Studys of Adhesion and Contact Thermal Resistance of TIM1
6个月前
已完结
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