Lv3
290 积分 2025-06-24 加入
Collective Die-to-Wafer Bonding of Si Dies and 4-Inch Polycrystalline Diamond Wafer with Ultralow Thermal Boundary Resistance and High Bonding Quality
1个月前
已完结
Optimal Heat Spreading Solutions for Three-Dimensional Heterogeneously Integrated Modules using a Multigrid Topology Optimization Method
2个月前
已完结
IEEE Standard for Ethernet Amendment 4: Physical Layer Specifications and Management Parameters for 100 Gb/s, 200 Gb/s, and 400 Gb/s Electrical Interfaces Based on 100 Gb/s Signaling
2个月前
已完结
The Studys of Adhesion and Contact Thermal Resistance of TIM1
4个月前
已完结
Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling
4个月前
已完结
H 3 : H ybrid Architecture Using H igh Bandwidth Memory and H igh Bandwidth Flash for Cost-Efficient LLM Inference
5个月前
已完结
Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies
5个月前
已完结
A T-Coil-Enhanced 8.5 Gb/s High-Swing SST Transmitter in 65 nm Bulk CMOS With $≪ -$16 dB Return Loss Over 10 GHz Bandwidth
6个月前
已完结
Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link
6个月前
已完结
Reinforcement Learning-Based Decap Optimization Method for High-Performance Solid-State Drive
6个月前
已完结
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