Lv3
320 积分 2025-06-24 加入
The Studys of Adhesion and Contact Thermal Resistance of TIM1
1个月前
已完结
Thermal-Resistance-Based Reliability of TIM1 Materials in a Lidded Thermal Test Vehicle Under Active Thermal Load-Cycling
1个月前
已完结
H 3 : H ybrid Architecture Using H igh Bandwidth Memory and H igh Bandwidth Flash for Cost-Efficient LLM Inference
2个月前
已完结
Effects of Metal Frame and Adhesive on Thermally-Induced Warpage and Stress of 2.5D Packages: Experimental and Numerical Studies
2个月前
已完结
A T-Coil-Enhanced 8.5 Gb/s High-Swing SST Transmitter in 65 nm Bulk CMOS With $≪ -$16 dB Return Loss Over 10 GHz Bandwidth
2个月前
已完结
Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link
2个月前
已完结
Reinforcement Learning-Based Decap Optimization Method for High-Performance Solid-State Drive
2个月前
已完结
Challenges and Development of Large Language Models Applied to Intelligent Hardware
3个月前
已关闭
Direct-to-Silicon Liquid Cooling Integrated on Cowos® Platform
4个月前
已完结
Wafer-Level Integration of Liquid Cooling Microchannel on CMOS Chips with Cu-Cu Low-Temperature Bonding Process
4个月前
已完结
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