| 标题 |
Design and Analysis of Double-side Characteristic Impedance Compensation Structure in 2.5D / 3D Package for High-speed Serial Link |
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| DOI | |
| 其它 |
期刊:2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) 作者:Seonghi Lee; Hyunwoong Kim; Jiyoung Park; Youngho Lee; Sungwook Moon; Seungyoung Ahn 出版日期:2023-09-13 |
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(2025-6-4)