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700 积分 2024-07-12 加入
Recent advances in hexagonal boron nitride based thermal interface materials: A minor review
1个月前
已完结
Highly Thermally Conductive and Low Dielectric Loss Flexible Printed Circuit Board with Anisotropically Arranged BN Filler and Its Application in the Field of Flexible Electronics
5个月前
已完结
Magnetically assisted vertical alignment of boron nitride nanosheets via viscosity modulation for thermal interface materials with low thermal resistance
5个月前
已完结
Effect of Al2O3 and BN compounding on thermal and mechanical properties of PP composites
7个月前
已完结
Magnetically assisted polyvinyl alcohol composites with highly anisotropic thermal conductivity and recyclability for advanced thermal interface materials
8个月前
已完结
One-pot strategy for multifunctional recyclable thermally conductive phase change composites toward efficient thermal management
1年前
已完结
Thermal management materials for 3D-stacked integrated circuits
1年前
已完结
Coupling effects of boron nitride and heat treatment on crystallization, mechanical properties of poly (3-hydroxybutyrate-co-3-hydroxyvalerate) (PHBV)
1年前
已完结
Microstructural, Mechanical, and Thermal Properties of Textured Si3N4/BN Composite Ceramics Prepared Using Two-Step Sintering
1年前
已完结
Horizontal array of BNNS@Ni for polydimethylsiloxane composites with high in-plane thermal conductivities and excellent photo-thermal performances
1年前
已完结
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