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30 积分 2026-03-20 加入
Void induced thermal impedance in power semiconductor modules: some transient temperature effects
5个月前
已完结
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information
5个月前
已完结
Die attachment, wire bonding, and encapsulation process in LED packaging: A review
6个月前
已完结
Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging
6个月前
已完结