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28 积分 2026-06-04 加入
Antiglare and antireflective coating of layer-by-layer SiO2 and TiZrO2 on surface-modified glass
13天前
已完结
Atomic layer deposition: an overview
18天前
已完结
Design and Verification of Silicon Bridge in 2.5d Advanced Package Based on Universal Chiplet Interconnect Express (Ucie)
1个月前
已完结
The influence of heat treatment process on electroplated metallized through glass vias (TGV) substrates
1个月前
已完结
High-speed wafer-level TGV interposer for 2.5D CPO
1个月前
已完结
Superconformal Filling of High Aspect Ratio through Glass Vias for Interposer Applications Using Tnbt and Ntbc Additives
1个月前
已完结
Microstructural evolution, residual stress, and mechanical property heterogeneity of high-aspect-ratio TGV copper interconnects fabricated by laser-assisted wet etching
1个月前
已完结
The simulation of copper deposition in through silicon vias and investigation on effects of additives
2个月前
已完结
Artificial intelligence-driven approaches for materials design and discovery
3个月前
已完结
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