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Thickness design guideline for precise laser-flash analysis of effective thermal conductivity of sintered silver
7小时前
已关闭
Reverse identification method for simultaneous estimation of thermal conductivity and thermal contact conductance of multilayered composites
10小时前
已完结
High-temperature electronic packaging for power modules: advances in sintering and transient liquid phase bonding technologies
8天前
已完结
Advances in Dysprosium Recovery from Secondary Sources: A Review of Hydrometallurgical, Biohydrometallurgical and Solvometallurgical Approaches
4个月前
已完结
Scalable and selective gold recovery from end-of-life electronics
4个月前
已完结
Development of high thermal conductivity of Ag/diamond composite sintering paste and its thermal shock reliability evaluation in SiC power modules
4个月前
已完结
High thermal conductivity diamond-doped silver paste for power electronics packaging
4个月前
已完结
Diamond/Ag-Ti composites with high thermal conductivity and excellent thermal cycling performance fabricated by pressureless sintering
4个月前
已完结
Tailoring nanotwinned Cu interlayers for localizing anisotropic plastic deformation during low energy input ultrasonic welding of robust Cu-Cu joints
4个月前
已完结
Experimental studies on application of silver paste in thermosonic flip-chip bonding
4个月前
已完结
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