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36 积分 2026-01-26 加入
Electrical resistivity of ultrafine-grained copper with nanoscale growth twins
1个月前
已完结
Monolithic and heterogeneous three-dimensional integration of two-dimensional materials with high-density vias
6个月前
已完结
Thermal management materials for 3D-stacked integrated circuits
6个月前
已完结
2D materials can unlock single-crystal-based monolithic 3D integration
6个月前
已完结
Building 3D integrated circuits with electronics and photonics
6个月前
已完结
Advanced packaging of chiplets for future computing needs
6个月前
已完结
Effects of organic acids on through-hole filling by copper electroplating
7个月前
已完结
Effects of organic acids on through-hole filling by copper electroplating
7个月前
已完结
Through-Hole Copper Electroplating Using Nitrotetrazolium Blue Chloride as a Leveler
7个月前
已完结
Investigating thermal runaway characteristics and trigger mechanism of the parallel lithium-ion battery
7个月前
已完结
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