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40 积分 2026-02-19 加入
A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages
14小时前
已完结
Crystal structure analysis of stacking faults through scanning transmission electron microscopy of β-Ga2O3 (001) layer grown via halide vapor phase epitaxy
26天前
已完结
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