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46 积分 2024-01-16 加入
Sidewall Suppression and Top Surface Enhancement of Light Extraction Efficiency in Vertically Stacked Full‐Color Micro‐LEDs Based on L‐Shaped Metal Walls
2小时前
已关闭
A simplified and high yield method for Micro-LED integration: Substitution of metal bumps with conductive photoresist in high-precision mass transfer
17天前
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Monolithic integration of p-MOSFETs with micro-LEDs on the same GaN LED epi
1个月前
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Monolithic integration of p-MOSFETs with micro-LEDs on the same GaN LED epi
1个月前
已关闭
Wafer-scale monolithic integration of full-colour micro-LED display using MoS2 transistor
1个月前
已完结
3175 PPI active-matrix Micro-LED device array towards full high-definition light engine
1个月前
已完结
Development of low temperature Cusingle bondCu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)
1个月前
已完结
Wafer-level three-dimensional integrated circuits (3D IC): Schemes and key technologies
1个月前
已关闭
Review-Recent Developments in Low Temperature Wafer Level Metal Bonding for Heterogenous Integration
1个月前
已完结
Laser transfer, printing, and assembly techniques for flexible electronics
1个月前
已完结
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