Lv43
417 积分 2024-04-05 加入
Heterogeneously Integrated Nitrogen-Vacancy Sensing for Real-Time CMOS Security Threat Detection
1小时前
已完结
Normally-off boron-doped diamond MOSFETs with a breakdown voltage over 1.7 kV
13小时前
已完结
Generation of High-Density Plasma Using High-Frequency Microwave
1天前
已完结
Simultaneously enhancing heat transfer ability, thermal expansion matching and thermal stability of diamond-reinforced Cu matrix composites through multi-level interface layer design
4天前
已完结
Optimized TIM1 Solution for Large 2.5D HPC Packages Using Silicone Matrix Containing Liquid Metal Materials
7天前
已完结
Achieving over 90% transfer rate in lithium niobate thin films on diamond (LNOD) heterogeneous integration using surface-activated bonding
10天前
已完结
High-Precision Thermal Characterization of Ultra-Low Thermal Resistance Copper Nano-Wire (CuNWs)-Polydimethylsiloxane (PDMS) Composite Thermal Interface Materials (TIMs) Tape
10天前
已完结
Fabrication and Thermal Characterization of Copper Nanowires (CuNWs) Thermal Interface Materials Tapes
10天前
已完结
A perspective on mechanism of heat transfer and performance optimization in advanced thermal interface materials
10天前
已完结
Enhanced interface heat transfer based on gallium-based liquid metal infiltrated into vertically aligned copper nanowire arrays
10天前
已完结
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