Lv3
250 积分 2025-10-28 加入
Process Design Kit and Initial Demonstration of Digital Metal-Embedded Chip Assembly for High Density IO Fan-Out Packaging
13天前
已完结
(Invited) Advanced Compute Scaling: A New Era of Exciting, Sustainability-Aware Innovations with Nanosheet-Based Devices, Increased Interdisciplinary Synergies, and (R)Evolution Towards Higher Versatility
1个月前
已完结
Intel 18A Platform Technology Featuring RibbonFET (GAA) and PowerVia for Advanced High-Performance Computing
1个月前
已完结
Ultra-low-profile Single-stage Voltage Regulator Module (VRM) for Next-generation AI Accelerators
3个月前
已完结
Ultra-Low-Profile Twisted Core Inductor for Vertical Power Delivery Voltage Regulator
3个月前
已完结
A Monolithic 5.7 A/mm2 91% Peak Efficiency Scalable Multistage Modular Switched Capacitor Voltage Regulator for Base Die Vertical Power Delivery in 3D-ICs
3个月前
已完结
Ultra-low-profile Single-stage Voltage Regulator Module (VRM) for Next-generation AI Accelerators
3个月前
已关闭
Multiphysics Challenges and Opportunities for Integrated Voltage Regulators in Power Delivery Architectures
3个月前
已关闭
DOJO: The Microarchitecture of Tesla’s Exa-Scale Computer
10个月前
已完结
Cerebras Architecture Deep Dive: First Look Inside the Hardware/Software Co-Design for Deep Learning
10个月前
已完结
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