Lv3
300 积分 2022-12-30 加入
Diamond‐Reinforced Al(H2PO4)3@Epoxy Hybrid Thermal Adhesive With Ultra‐High Thermal Conductivity and Bonding Strength
10个月前
已完结
A Full-component recyclable Epoxy/BN thermal interface material with anisotropy high thermal conductivity and interface adaptability
10个月前
已完结
Microstructured BN Composites with Internally Designed High Thermal Conductivity Paths for 3D Electronic Packaging
10个月前
已完结
Flexible boron nitride composite membranes with high thermal conductivity, low dielectric constant and facile mass production
10个月前
已完结
Performance of Thermal Interface Materials
10个月前
已完结
In-situ synchrotron X-ray study on microstructure and stress evolutions of electroplated copper upon self-annealing
1年前
已完结
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