Lv2
134 积分 2024-02-23 加入
Preparation and post-treatment of silver powders for front contact pastes of silicon solar cells
12天前
已完结
Controlled and Uniform Wet Etching of Molybdenum Nanowires
19天前
已完结
Chip warpage and stress analysis in power modules of different substrate configurations
2个月前
已完结
Present status and prospects of nano-silver particles in the electronic field: a review
2个月前
已完结
The Study of Void Formation in Ag Sinter Joint
3个月前
已完结
Effects of Joining Conditions on Joint Strength of Cu/Cu Joint Using Cu Nanoparticle Paste
3个月前
已完结
Ultrasonic spray pyrolysis for air-stable copper particles and their conductive films
3个月前
已完结
Mixed Cu Nanoparticles and Cu Microparticles with Promising Low-temperature and Low-pressure Sintering Properties and Inoxidizability for Microelectronic Packaging Applications
3个月前
已完结
Approaching the structure-property relationship of sintered metal nano/microparticles from the perspective of the agglomerate size effect
4个月前
已完结
Micro-Raman to detect stress phenomena in Si-chips bonded onto Cu substrates
4个月前
已完结
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