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34 积分 2025-11-19 加入
Chiplet-based System PSI Optimization for 2.5D/3D Advanced Packaging Implementation
14天前
已完结
Thermal and mechanical simulations of 3D packages with custom high bandwidth memory (HBM)
14天前
已完结
A 7-nm 4-GHz Arm¹-Core-Based CoWoS¹ Chiplet Design for High-Performance Computing
17天前
已完结
Multiphysics Analysis on 2.5D Chiplet Structures
18天前
已完结
A study of Multi-objective Thermal Management for TTSV Arrays in Three-Dimensional Integrated Circuits
1个月前
已完结
Modeling and Analysis of 3D IC Structures for Heat Mitigation by Thermal Through Silicon Vias
1个月前
已完结
Intelligent Design Method of Thermal Through‑Silicon via for Thermal Management of Chiplet‑Based System
1个月前
已完结
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded
1个月前
已完结
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer
1个月前
已完结
Impact of 3-D Integration on Thermal Performance of RISC-V MemPool Multicore SOC
1个月前
已完结
How does the travel effect of e-shopping differ by travel mode? Empirical evidence from Chengdu, China
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