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80 积分 2023-09-25 加入
Poly(p-tert-butoxycarbonyloxystyrene): a convenient precursor to p-hydroxystyrene resins
11个月前
已完结
A strategy to prepare low-temperature curable photosensitive polyimide with good comprehensive performance
1年前
已完结
A high-bandwidth and low-cost data processing approach with heterogeneous storage architectures
1年前
已完结
Regulation of inflammation as an anti‐aging intervention
1年前
已完结
A route to fluoroalkyl-substituted aromatic compounds involving fluoroalkylcopper intermediates
1年前
已完结
Recent Advances in Machining of Silicon Wafers for Semiconductor Applications
1年前
已完结
Copper Wire Bonding: A Review
1年前
已完结
Development and optimization of the laser-assisted bonding process for a flip chip package
1年前
已完结
Microwave signal switching on a silicon photonic chip
1年前
已完结
Reliability of wirebonds in micro‐electronic packages
1年前
已完结
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