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664 积分 2023-09-20 加入
Recent Advances and Trends in Advanced Packaging
2天前
已完结
飞秒激光三光束干涉制备SiC表面非对称微纳周期结构
2个月前
已完结
A review: wafer bonding of Si-based semiconductors
3个月前
已完结
A 3.584 Tbps coherent receiver chip on InP-LiNbO3 wafer-level integration platform
3个月前
已完结
Lithium niobate single crystal thin film resonator with benzocyclobutene as a reflective layer
5个月前
已完结
Stress reduction and wafer bow accommodation for the fabrication of thin film lithium niobate on oxidized silicon
5个月前
已完结
100 GHz bandwidth, 1 volt integrated electro-optic Mach–Zehnder modulator at near-IR wavelengths
5个月前
已完结
Lithium tantalate photonic integrated circuits for volume manufacturing
6个月前
已完结
Hybrid 3C-silicon carbide-lithium niobate integrated photonic platform
6个月前
已完结
Proton exchange-enhanced surface activated bonding for facile fabrication of monolithic lithium niobate microfluidic chips
6个月前
已完结
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