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24 积分 2023-07-12 加入
Mechanically modeling chemical mechanical planarization from wafer to molecular scales: a review and discussion of future direction
3天前
已完结
Tailoring CeO₂ abrasive morphology and crystal facets for enhanced chemical mechanical polishing of SiO₂
12天前
已完结
Controllable synthesis of core-shell SiO2@CeO2 composite abrasives for chemical mechanical polishing of EMC-Si-Cu multi-heterointerfaces
13天前
已完结
Preparation of silane modified SiO2 abrasive particles and their Chemical Mechanical Polishing (CMP) performances
13天前
已完结
Atomistic insights into shell-modulated interfacial interactions of core-shell SiO2@organic polymer abrasives for silicon chemical mechanical polishing
15天前
已完结
Recent advances in design and preparation of abrasives for chemical mechanical polishing of hard-brittle materials
16天前
已完结
Challenges, development and future of silica abrasives in chemical mechanical polishing derived from past six decades
16天前
已完结
Strategies for Enhancing SiO2 Chemical-Mechanical Polishing (CMP): Functional Nanoparticle Abrasive Design and Integration
16天前
已完结
Microstructure-mechanism-performance relationships in hard carbon anode materials for sodium-ion batteries
19天前
已完结
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