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Electromigration Failures in Integrated Circuits: A Review of Physics-Based Models and Analytical Methods
9天前
已完结
Experimental study of time-dependent dielectric degradation by means of random telegraph noise spectroscopy
9天前
已完结
An electromigration study of novel 3D Cu stack-via interconnects for advanced high-density fan-out packaging
9天前
已完结
Void Migration Kinetics in Fine Line Cu RDL under Electric Current Stressing and the Improvement of Electromigration Reliability by Polyimide Passivation
9天前
已完结
Direct Observation of Void Nucleation and Growth in a 2-µm-Wide Cu Redistribution Line During In Situ Electromigration
9天前
已完结
Embedded Grating Sensing and Compensation Enabling Cross-Scale Nanopositioning
27天前
已完结
Modeling and Control of a Piezo-Driven XYZ Series-Type Compliant Nanopositioning Stage
27天前
已完结
Design and Testing of a Damped Piezo-Driven Decoupled XYZ Stage
27天前
已完结
A Totally Decoupled Piezo-Driven XYZ Flexure Parallel Micropositioning Stage for Micro/Nanomanipulation
27天前
已完结
Design of a Flexure-Based XYZ Micropositioner With Active Compensation of Vertical Crosstalk
27天前
已完结
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