Lv2
150 积分 2024-10-21 加入
Improved resistance to thermal fatigue of active metal brazing substrates for silicon carbide power modules using tough silicon nitrides with high thermal conductivity
12小时前
已完结
Sintered reaction-bonded silicon nitride ceramics for power-device substrates -review-
12小时前
已完结
Research Progress of High Thermal Conductivity Silicon Nitride Ceramics Prepared by Non-oxide Sintering Additives
13小时前
已完结
Progress of High Strength and High Thermal Conductivity Si3N4 Ceramics for Power Module Packaging
13小时前
已关闭
Emerging Advanced Electronic Packaging Materials for Thermal Management in Power Electronics
13小时前
已完结
Thermal Management on IGBT Power Electronic Devices and Modules
13小时前
已完结
Advancements in thermal management solutions for electric vehicle high-power electronics: Innovations, cooling methods, and future perspectives
13小时前
已完结
The application of multi-scale simulation in advanced electronic packaging
13小时前
已完结
Thermal Networks for Power Semiconductor Modules in Power Electronic Systems: A Review
14小时前
已完结
Reliability of Wide Band Gap Power Electronic Semiconductor and Packaging: A Review
14小时前
已完结
皖公网安备34019202002308
