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28 积分 2024-10-21 加入
Phonon transport in graphene based materials
15小时前
已完结
Morphology-Controllable Liquid Metal/Diamond Sandwich-Structured Thermal Interface Material toward High-Efficiency Thermal Management
12天前
已完结
Comparative Study of Pressurized and Capillary Underfill Flow Using Lattice Boltzmann Method
1个月前
已完结
Flip-Chip Underfill: Materials, Process, and Reliability
1个月前
已关闭
Epoxy/silane pre-synthesis improving thermal properties and adhesion strength of silica-filled non-conductive adhesive for fine-pitch thermocompression bonding
1个月前
已完结
Packaging Materials in High-Performance Computing Applications
1个月前
已完结
Thermal interface polymer-based composites materials: a critical review
1个月前
已完结
Advancements in electronics cooling techniques: focus on graphene’s prospects, challenges, and future directions
1个月前
已完结
Surface-metallized diamond/liquid metal composites through diamond size engineering as high-performance thermal interface materials
2个月前
已完结
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