Lv52
1526 积分 2024-10-15 加入
Highly thermal conductivity flexible composite films based on alumina-boron nitride binary fillers
14天前
已完结
Ultrahigh thermal conductivity and low thermal resistance carbon fiber thermal pad achieved by 3D printing
1个月前
已完结
Recent advances in hexagonal boron nitride based thermal interface materials: a minor review
1个月前
已完结
Examining the Mechanism of Current Conduction at Varying Temperatures in Polyimide Nanocomposite Films
1个月前
已完结
Unravelling the role of filler surface wettability in long-term mechanical and dielectric properties of epoxy resin composites under hygrothermal aging
1个月前
已完结
Mobile‐Chain‐Assisted Flow Alignment and Interfacial Adaptation Enable Elastomeric Thermal Interface Materials with High through‐Plane Thermal Conductivity and Low Contact Thermal Resistance
1个月前
已完结
Application Study of Epoxy Prepreg for Thermally Conductive Materials
1个月前
已完结
Ultrahigh Thermal Conductivity and Low Thermal Resistance Carbon Fiber Thermal Pad Achieved by 3D Printing
1个月前
已完结
Liquid metal as a dynamic thermal bridge for high-performance epoxy molding compounds with continuous heat transfer networks
1个月前
已完结
A Dual Magnetic‐Centrifugal Field Strategy for Orienting Thermal Fillers in High Thermal Conductivity Composites
1个月前
已完结