Lv4
666 积分 2024-10-15 加入
Thermal interface materials: A promising solution for passive heat dissipation in electronic appliances
12小时前
待确认
Cooling next-generation electronics: From emerging semiconductors to data centers
26天前
已完结
Surface‐Energy‐Matched Interfaces as Key Design Rule for Ultra‐Low‐Resistance Thermal Interface Materials
1个月前
已完结
Deformable surface design of vertical graphene thermal interface materials for efficient heat dissipation
1个月前
已完结
Advanced polymer-based thermal interface materials: A review on matrix optimization and filler engineering for superior performance
1个月前
已完结
Fractal network design for soft, tough, antifatigue elastomer composites with high thermal conductivity
1个月前
已完结
Multifunctional carbon nanotube@expanded graphite/polydimethylsiloxane composites with exceptional electromagnetic interference shielding and thermal management capability
1个月前
已完结
The vertically oriented CFs@Al2O3 filled silicone rubber elastomer material to construct effective electromagnetic wave absorption network and high thermal conductivity path
1个月前
已完结
Regulatable Orthotropic 3D Hybrid Continuous Carbon Networks for Efficient Bi-Directional Thermal Conduction
1个月前
已完结
Extremely low thermal resistance in solid-state thermal pad from in situ graphite cracking for high-power artificial intelligence chip
1个月前
已完结
皖公网安备34019202002308
