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20 积分 2026-05-06 加入
Low-temperature reliability enhancement of system-in-package with silicon-based resistors and its electrothermal analysis
3个月前
已完结
Study on warpage stress in SiP packages during reflow soldering
3个月前
已完结
An efficient quasi-transient electro-thermal algorithm for system-in-package based on the unconditionally stable finite-difference method
3个月前
已完结
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review
3个月前
已完结
Study on warpage stress in SiP packages during reflow soldering
3个月前
已完结
Low-temperature reliability enhancement of system-in-package with silicon-based resistors and its electrothermal analysis
4个月前
已关闭
Thermal stress and drop stress analysis based on 3D package reliability study
4个月前
已完结
A Review of System-in-Package Technologies: Application and Reliability of Advanced Packaging
4个月前
已完结
Thermo-mechanical reliability analysis of a RF SiP module based on LTCC substrate
4个月前
已完结
Multi-Physics Fields Simulations and Optimization of Solder Joints in Advanced Electronic Packaging
4个月前
已完结
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