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40 积分 2026-05-25 加入
Copper to resin adhesion characterization for power electronics application: Fracture toughness and cohesive zone analysis
24天前
已完结
The Influence of the Stamping Parameters on the Warpage of Leadframe
1个月前
已完结
Analysis of load-displacement curves of an adhesive-reinforced composite patch repaired plate using the combination of XFEM and CZM techniques
2个月前
已完结
Measurement of linear coefficient of thermal expansion and temperature-dependent refractive index using interferometric system
2个月前
已完结
Fracture behavior of epoxy molding compounds
3个月前
已完结
Designing the Platinum Catalyst Layer for Improved Performance and Durability in Anion Exchange Membrane Water Electrolysis
5个月前
已完结
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