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56 积分 2024-06-25 加入
Mechanisms underlying the nucleation processes of mesoporous ceria nanoparticles
4天前
已完结
Activity‐Tunable Ultrasmall Ceria Abrasive for Ultra‐Precision Chemical Mechanical Polishing of Semiconductor Dielectric Layers
4天前
已完结
[Application of IR spectrum to the research on coordination mechanisms of organic carboxylic acid during homogeneous precipitation]
12天前
已关闭
Study of the preparation and properties of CeO2single/multiwall hollow microspheres
25天前
已完结
Cavitation-driven nanosecond laser irradiation assisted chemical–mechanical-polishing (CMP) for atomic-scale material removal of 4H-SiC
1个月前
已完结
Preparation of Chlorine-doped CeO2 Abrasive and Investigation of Chemical-Mechanical Polishing Properties
3个月前
已关闭
Study on Ceria Slurry for Chemical Mechanical Polishing of 4H-SiC
4个月前
已完结
Study on aqueous film‐forming foam extinguishing agent based on fluorocarbon cationic–hydrocarbon anionic surfactants mixture system
6个月前
已完结
Recent advances in CeO2 based abrasives for chemical mechanical polishing
6个月前
已完结
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