Lv3
288 积分 2021-09-12 加入
Thermal performance analysis of supporting column ultra-thin vapor chamber with graded microgroove
2天前
已完结
Straight ultra-thin vapor chambers tested under different modes for different vapor duct thicknesses
11天前
已完结
Mechanism of a microscale flat plate heat pipe with extremely high nominal thermal conductivity for cooling high-end smartphone chips
11天前
已完结
A novel vapor chamber with gradient capillary wick and larger expansion area
11天前
已完结
Visualization experimental study on the boiling characteristics of vapor chamber evaporator surface with different heat sources
11天前
已完结
A novel flat heat pipe for anti-gravity orientations: Leaf fractal evaporator and bi-directional transport capillary channel
11天前
已完结
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
1个月前
已完结
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
2个月前
已完结
Experimental study on the thermal performance of aluminum three-dimensional vapor chamber heat sink with a louvered-fin stacked evaporator wick for data center servers
2个月前
已完结
Additively manufactured aluminum heat pipes with hierarchical porous groove wick structures
2个月前
已完结
A Novel Metal Foam‐Supported Solid Oxide Fuel Cell With High Specific Power
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