Lv31
308 积分 2021-09-12 加入
A 0.25-mm-thick ultra-conductive thermal ground plane for cooling compact electronics
3小时前
已完结
Fully diamond-based embedded manifold microchannel heat sink: Achieving ultra-high heat flux cooling
20天前
已完结
Experimental study on the thermal performance of aluminum three-dimensional vapor chamber heat sink with a louvered-fin stacked evaporator wick for data center servers
26天前
已完结
Additively manufactured aluminum heat pipes with hierarchical porous groove wick structures
1个月前
已完结
Non-condensable gas effects in flat heat pipes: LBM insight from disturbance to thermal resistance
2个月前
已关闭
Effects of process parameters on selective laser melting of Ti6Al4V-ELI alloy and parameter optimization via response surface method
5个月前
已完结
Development of lattice structure with selective laser melting process: A state of the art on properties, future trends and challenges
5个月前
已完结
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