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28 积分 2023-07-31 加入
Future interconnect materials for highly integrated semiconductor devices
20天前
已完结
Cu diffusion barrier: Graphene benchmarked to TaN for ultimate interconnect scaling
1个月前
已完结
Synergistic Enhancements of Niobium Metal–Organic Framework/V2CTx Composites with Graphene Quantum Dots for Energy Storage and Hydrogen Evolution
1个月前
已完结
Incorporating Niobium in MoS2 at BEOL-Compatible Temperatures and its Impact on Copper Diffusion Barrier Performance
2个月前
已完结
Effect of intermetallic compound evolution on tensile damage mechanical properties of Cu/Sn micro-solder joints under multi-field coupling
3个月前
已完结
An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints
3个月前
已完结
Effective construction of a CuCo MOF@graphene functional electrocatalyst for hydrogen evolution reaction
6个月前
已完结
Designing and synthesizing metal-organic framework/graphene nanocomposites
7个月前
已完结
Anomalous Increase in Carbon Capacitance at Pore Sizes Less Than 1 Nanometer
11个月前
已完结
Six‐Output Ultra‐Robust Flexible Piezoresistive Sensor Based on Electrode Matrix
1年前
已完结
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