Lv11
66 积分 2023-09-11 加入
Effect of high-temperature wettability of glass on interfacial contact quality during metallization of silver electrodes in solar cells
4小时前
待确认
Plasma-Enabled Ligand Removal for Improved Catalysis: Furfural Conversion on Pd/SiO2
9天前
已完结
Investigating the physical, mechanical, and reliability study of high entropy alloy reinforced Sn–3.0Ag–0.5Cu solder using 1608 chip capacitor/ENIG joints
11天前
已完结
Microwave hybrid joining of SAC305-Ni@Sn composite solder: Heating mechanism, mechanical reliability, and first-principles calculation
1个月前
已完结
Insight into influence of temperature on electrochemical corrosion behavior of SAC305 tin-based solder alloy in NaCl solution
1个月前
已完结
Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review
1个月前
已完结
Multi-site orbital coupling in Ru-based high-entropy alloy-enabled hydroxyl spillover for enhanced peroxidase-like activity
2个月前
已完结
Programming Cascade Catalysis in Multielement Dual-Heterostructured Catalysts Through Gradient Adsorption Potentials
2个月前
已完结
A Smartphone-Mediated “All-In-One” Biosensing Chip for Visual and Value-Assisted Detection
2个月前
已完结
Enzyme‐Nanozyme Cascade Flow Reactor Synergy with Deep Learning for Differentiation and Point‐of‐Care Testing of Multiple Organophosphorus Pesticides
2个月前
已完结
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