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2024-06-13 加入
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Effect of ultrasonic transmission rate on microstructure and properties of the ultrasonic-assisted brazing of Cu to alumina
7小时前
已完结
The effects of oxidation temperature on the capacitance–voltage characteristics of oxidized AlN films on Si
3个月前
已完结
Continued study in power module substrates for automotive harsh environments
6个月前
已关闭
Strengthening mechanism of Si, V and Ti atoms to the Ag/AlN interface: a study from first-principles calculations
6个月前
已完结
Interfacial reactions in actively brazed Cu-Al2O3 composites and copper using a newly developed Cu-Sn-Ag-Ti filler alloy
9个月前
已完结
MATERIAL PROPERTIES ANALYSIS OF CIRCUIT SUBASSEMBLIES: QUANTITATIVE CHARACTERIZATION OF SAPPHIRE (alpha-Al203) AND SILICON NITRIDE (Si3N4) USING CRYOGENIC CYCLING
10个月前
已关闭
Continued study in power module substrates for automotive harsh environments
10个月前
已关闭
AMB ceramic substrates, a conventional alternative to unconventional thermal requirements
10个月前
已关闭
Effects of Indium Content on the Tensile Properties of Sn-Bi-In Solder
1年前
已完结
Direct Deposition of Graphene on Metal Substrates by Plasma Enhanced Chemical Vapor Deposition for Transparent Electrode Applications
1年前
已关闭
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感谢
3个月前
感谢,点赞,速度真快
9个月前
感谢,点赞,速度真快,么么哒
1年前
速度真快,帮大忙了,感谢,点赞,么么哒
1年前
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