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30 积分 2024-11-08 加入
Thermo-mechanical fatigue life prediction of SiC power device based on finite element simulation
2个月前
已完结
Guest editorial: 24th international conference on electronic packaging technology
3个月前
已完结
A Double-Sided 650 V GaN Power Device Using Flexible Buffers with Low Parasitic Inductance
5个月前
已完结
Pressureless Large-Area (15 × 15 mm2) Bonding by Novel Silver Paste for WBG Packaging
5个月前
已完结
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging
5个月前
已完结
Pulsed electric current-assisted transient liquid phase sintering for extremely reliable Cu-Cu direct bonding
5个月前
已完结
Self-oxygenation silver paste for SiC power modules with high thermal dissipation reliability
5个月前
已完结
Simultaneous Enhancement of Electrochemical Migration Lifetime and Reliability of Sintered Silver
5个月前
已完结
Reliability Behavior of A Resin-Free Nanosilver Paste at Ultra-Low Temperature of 180°C
5个月前
已完结
Reliability Improvement of Low-Temperature Sintered Nano-Silver as Die Attachment by Porosity Optimization
5个月前
已完结
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