Lv11
48 积分 2025-03-29 加入
Study on changes in intermetallic compounds and whisker formation over time in Sn/Cu plating
4小时前
待确认
Enhance cryogenic ductility and strength of body-centered tetragonal Sn by pre-twinning and recrystallization
14天前
已完结
Cyclic twin nucleation in tin-based solder alloys
26天前
已完结
Investigation of Temperature Distribution in Friction Stir Welding with Experimental and Regression Algorithms
1个月前
已完结
Determination of biaxial stress and strain states of fibre-textured thin films by X-ray diffraction measurements
1个月前
已完结
Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes
2个月前
已完结
Numerical simulation of SAC305/Cu friction inlay welding based on Coupled Eulerian–Lagrangian approach
4个月前
已完结
Microstructural response characteristics of SAC305/Cu column joint under friction embedded welding conditions
4个月前
已完结
Material-length-scale-controlled nanoindentation size effects due to strain-gradient plasticity
4个月前
已完结
Balancing temperature and time in reflow soldering for improving Sn-3.0Ag-0.5Cu solder joint strength
4个月前
已完结
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