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30 积分 2024-03-03 加入
Microstructure of reaction layer and its effect on the joining strength of SiC/SiC joints brazed using Ag-Cu-In-Ti alloy
1个月前
已完结
High-performance thermoelectrics and challenges for practical devices
1个月前
已完结
Thermoelectric Properties of Multifilled Skutterudites with La as the Main Filler
1个月前
已完结
Stability of Skutterudite Thermoelectric Materials
1个月前
已完结
Development of Skutterudite Thermoelectric Materials and Modules
1个月前
已完结
A universal approach to high-performance thermoelectric module design for power generation
1个月前
已完结
Study on properties of AgCuInTi filler metal for active bonding of alumina ceramic
4个月前
已完结
Low-temperature sintering of Ag nanoparticles for high-performance thermoelectric module design
4个月前
已完结
Toward Efficient Thermoelectric Materials and Devices: Advances, Challenges, and Opportunities
5个月前
已完结
Interdependent optimization strategies for material, module, and system designs in thermoelectric devices
5个月前
已完结
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