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40 积分 2023-10-14 加入
Study of Direct Copper Electroplating on Ruthenium Seed Layer for Nano-TSVs Processes on 300mm Wafers
4个月前
已完结
Short-range order in amorphous oxygen-deficient TaOx thin films and its relation to electrical conductivity
5个月前
已完结
The interaction mechanism of titanium alloy TC4 between passive film and sulfate reducing bacteria biofilm in marine environment
9个月前
已完结
Additively manufactured Nb-Ti-Si based alloy: as-built and heat-treated conditions
11个月前
已关闭
The synthesis and mechanism investigations of morphology controllable 1-D SiCnanostructuresvia a novel approach
11个月前
已完结
Optimization of TbAl grain boundary diffusion source for sintered Nd-Fe-B magnet by low cost Nd substitution for Tb
11个月前
已完结
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