Lv4
470 积分 2025-01-07 加入
Investigation of degradation mechanism in GaN-based blue and ultraviolet laser diodes
5天前
已关闭
Predicting trends in rate parameters for self-diffusion on FCC metal surfaces
7天前
已关闭
Microstructure evolution and abnormal grain growth during copper wafer bonding
7天前
已完结
Combined Surface Activated Bonding Technique for Low-Temperature Cu/Dielectric Hybrid Bonding
9天前
已关闭
Overview and Outlook of Three-Dimensional Integrated Circuit Packaging, Three-Dimensional Si Integration, and Three-Dimensional Integrated Circuit Integration
10天前
已完结
Room temperature bonding of SiO2 and SiO2 by surface activated bonding method using Si ultrathin films
12天前
已完结
Microstructure evolution and abnormal grain growth during copper wafer bonding
3个月前
已完结
Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method
3个月前
已完结
Copper Bonding Technology in Heterogeneous Integration
3个月前
已完结
Robust temperature–strain coupling in phase and shape evolution of MoTe2 nanosheets
3个月前
已完结
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