Lv41
480 积分 2025-01-07 加入
Microstructure evolution and abnormal grain growth during copper wafer bonding
53分钟前
待确认
Structure of AlAl and AlSi3N4 interfaces bonded at room temperature by means of the surface activation method
2小时前
已完结
Copper Bonding Technology in Heterogeneous Integration
6小时前
已完结
Robust temperature–strain coupling in phase and shape evolution of MoTe2 nanosheets
10天前
已完结
Strain‐Plasmonic Coupled Broadband Photodetector Based on Monolayer MoS2
2个月前
已完结
Robust temperature–strain coupling in phase and shape evolution of MoTe2 nanosheets
2个月前
已完结
Modeling Population Dynamics and Assessing Ecological Impacts of Lampreys via Sex Ratio Regulation
3个月前
已关闭
Monolithic three-dimensional tier-by-tier integration via van der Waals lamination
3个月前
已完结
A New Single Chip High-Overload Tri-Axial MEMS Gyroscope with Multi-Wheel-Ring for Z-Axis Input Range Enhancement
3个月前
已完结
An Orthogonal Code-Division Multiplexing AFE with low Channel-Gain-Mismatch by Input Capacitors Calibration Technology
4个月前
已完结
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