Lv11
30 积分 2026-08-30 加入
AceTherm: Accelerated Thermal Analysis of Chiplet Integration Using Non-Conformal FEM
1小时前
求助中
Physics-guided, uncertainty-aware machine learning for non-invasive deep thermal interface characterization in hybrid-bonded 3D ICs without prior geometric knowledge
18天前
已完结
Physical feature-based machine learning of BEOL thermal conductivity in 3D ICs
18天前
已完结
Process-induced thermal conductivity degradation in Cu micro pads for 3D-IC hybrid bonding revealed by spatially resolved frequency-domain thermoreflectance
19天前
已完结
Mechanistic insights into thermal transport in BEOL multilayers via optical metrology and multiphysics simulation
19天前
已完结
Thermal-mechanical co-design and optimization of 2.5D chiplet integration
1个月前
已完结
Multiscale thermal modeling of advanced back-end-of-line stacks considering size effects and nanoscale interfaces
1个月前
已完结
Research progress of hybrid bonding technology for three-dimensional integration
1个月前
已完结
Analysis and optimization of Cu/SiO2 hybrid bonding interfacial reliability based on FEA and GABP-NSGA Ⅱ algorithm
1个月前
已完结
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