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110 积分 2024-08-17 加入
Analytical and numerical analyses of filling progression and void formation in flip-chip underfill encapsulation process
4小时前
已完结
Two-phase flow boiling in a microfluidic channel at high mass flux
2个月前
已完结
SIMULATION OF CELL MOTION IN THE MICROCHANNEL WITH A SQUARE CAVITY
2个月前
已完结
On pressure and velocity boundary conditions for the lattice Boltzmann BGK model
2个月前
已完结
Evaluation of outflow boundary conditions for two-phase lattice Boltzmann equation
2个月前
已完结
Epidermis-on-a-chip system to develop skin barrier and melanin mimicking model
2个月前
已完结
Modeling of a Single Bubble Dynamics at Boiling by Lattice Boltzmann Method
2个月前
已完结
Disintegration of water drops in an electric field
5个月前
已完结
Flow boiling of HFE-7100 for cooling Multi-Chip modules using manifold microchannels
5个月前
已完结
Incorporation of EHD Enhancement in Heat Exchangers
6个月前
已完结
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