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90 积分 2024-08-17 加入
A rapid and meshless analytical model of acoustofluidic pressure fields for waveguide design
11小时前
已完结
Particle concentration and mixing in microdrops driven by focused surface acoustic waves
12天前
已完结
Study of micro-scale flow characteristics under surface acoustic waves
17天前
已完结
Underfill Dispensing for 3D Die Stacking with Through Silicon Vias
22天前
已完结
Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
30天前
已完结
Flip the Chip
30天前
已完结
Engineering Surface Properties and Structural Designs for Controlling Underfill Dynamics in Flip-Chip Packaging
1个月前
已完结
3D Integration technology: Status and application development
1个月前
已完结
Microscale underfill dynamics and void formation of high-density flip-chip packaging: Experiments and simulations
1个月前
已完结
Spatial analysis of underfill flow in flip-chip encapsulation
1个月前
已完结
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