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30 积分 2026-04-18 加入
Establishment and simulation study of equivalent model for thermal contact resistance in electronic devices
12小时前
待确认
High-brightness 808 nm semiconductor laser diode packaged by SiC heat sink
1个月前
已完结
The improvement in heat transfer performance of single crystal silicon carbide with diamond film
3个月前
已完结
Microstructure and performance of graphite/TZM alloy joints with different interfacial structures formed by vacuum diffusion bonding
5个月前
已完结
The influence of interface structure on the microstructure and properties of Cu/graphite joint prepared by vacuum diffusion bonding
5个月前
已关闭
Microstructure and mechanical properties of copper/al interlayer/graphite joint prepared utilizing “two-stage method” vacuum diffusion bonding
5个月前
已完结
Rapid bonding of graphite to Al and Cu based on ultrasonic vibration-assisted lower temperature metallization
5个月前
已完结
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