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48 积分 2022-09-07 加入
Enhancing epoxy resin curing: Investigating the catalytic role of water as a trace impurity in dense crosslinked network formation using an advanced cat-GRRM/MC/MD Method1
2个月前
已完结
Enabling flexible copper-clad laminates via silver-assisted patterning on sequence-defined low dielectric polyimide
2个月前
已完结
Hydrocarbon Resin-Based Composites with Low Thermal Expansion Coefficient and Dielectric Loss for High-Frequency Copper Clad Laminates
2个月前
已完结
Synergistic Effects of Bio‐Based Benzoxazine/Epoxy Blends for Copper‐Clad Laminates With Low Dielectric Performance
2个月前
已完结
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