Lv2
110 积分 2026-06-02 加入
Machine learning aided modelling of thermomechanical fatigue of solder joints in electronic component assemblies
11小时前
已完结
A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages
11小时前
已完结
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding
1个月前
已完结
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
2个月前
已完结
Four Decades of E-Model Development for Time-Dependent Dielectric Breakdown (TDDB)
2个月前
已完结
Degradation mechanisms-based reliability modeling for metallized film capacitors under temperature and voltage stresses
2个月前
已完结
Microstructural and temperature-dependent deformation mechanisms governing the cyclic creep of freestanding, submicrometer gold thin films
2个月前
已关闭
The Effects of Tildrakizumab in the Epigenetic Aging Deviation of Psoriasis: A 52-Week Open-Label Study
12小时前
已采纳
Preserving the reversibility of oxygen redox to stabilize Li-rich cathodes for long-life and high-energy lithium-ion batteries
12小时前
已采纳
Comparative Study on the Usability and Kansei of Physical and Touchscreen Automotive Interfaces
12小时前
已采纳
皖公网安备34019202002308
