Lv11
66 积分 2026-06-25 加入
Halogen-Free Epoxy with Enhanced Corrosion Resistance for Microelectronics Packaging via γ SN2 Nucleophilic Substitution
1个月前
已完结
High Efficiency Screen-Printed Ag-Free PERC Solar Cell With Cu Paste and Laser-Enhanced Contact Optimization
1个月前
已完结
Tuning the rheology of copper pastes with reliable printability and enhanced storage stability
1个月前
已完结
Copper Sintering Pastes with Various Polar Solvents and Acidic Activators
1个月前
已完结
Solvent-free Cu sintering pastes using acidic activators
1个月前
已完结
Antioxidant High‐Conductivity Copper Pastes Based on Core–Shell Copper Nanoparticles for Flexible Printed Electronics
1个月前
已完结
The effect of thinner SDS-coated Ag NPs and organic carrier PVAc on properties of low-temperature silver paste
1个月前
已完结
Dual-Curing Epoxy Thermosets: Design, Curing, Properties and Applications
1个月前
已完结
Preparation of low‐temperature curing single‐component epoxy adhesives with sedimentation coated accelerators
2个月前
已完结
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